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INFINITE FLEX

PURE COPPER POWDER ( > 99.5%)

FOR ADDITIVE MANUFACTURING

3D PRINITING OF COPPER WITH STANDARD IR LASER

Properties

  • Electr. Conductivity > 52 MS/m (91% IACS)

  • Therm. Conductivity > 360 W/(m*K)

  • Tensile strength: > 220 MPa

  • Yield limit Rp 0.2: > 110 MPa

  • Elongation at break: 24%

  • ideally suited on all commonly used
    SLM systems (e.B. EOS M 290, GE M2)

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Product Information

  • Copper Content > 99.5%.

  • Particle size: 10 – 45 microns

  • Particle size (D50):30 microns

  • Volume build-up rate: 2.2 mm3/s

  • Layer construction thickness: 30 microns

  • Porosity: < 0.1%

  • TRL Level 3

  • Area angle: > 41°

INFINITE POWDER CU 01

INFINITE POWDER CU 01 uses a patent-pending post-treatment of copper powder. This process, specially developed for additive manufacturing, makes a problem-free 3D printing of copper with all common standard infrared lasers possible in the first place.

Applications

  • Selective laser sintering (SLM)

  • Laser application welding (LMD)

  • Plasma Metallization / Digital Direct Metallization (DDM)

    Electrical and thermal conductivity

  • Electr. Conductivity > 52 MS/m (91% IACS)

  • Therm. Conductivity > 360 W/(m*K)

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